| Assist Prof Dr | Siddhartha | Biswas | University of North Bengal | India | Thermoplastic composites | Mathermatics | Best Researcher Award | View Profile |
| Assist Prof Dr | Reza | Gholizadeh | National Institute of Chemistry | Slovenia | Modeling | Material Science | Best Researcher Award | View Profile |
| Assist Prof Dr | Saeed | Ahmed | University of Chakwal | Pakistan | Design of Materials and Components | Material Chemistry | Best Researcher Award | View Profile |
| Assist Prof Dr | Gulsah | Demirhan Aydin | Başkent University | Turkey | Bonding | https://www.mdpi.com/2072-666X/15/8/935 A cost-effective, high-performance approach to achieving wafer level vacuum packaging (WLVP) for MEMS-based uncooled infrared sensors | Best Researcher Award | View Profile |
| Assist Prof Dr | Jiyeon | Han | University of Seoul | South Korea | Other | Bioinorganic chemistry - metalloprotein | Best Researcher Award | View Profile |