Tailong Shi | Glass Panel Embedded | Young Scientist Award

Assoc.Prof. Dr. Tailong Shi, Southeast University, China.

Dr. Tailong Shi is a highly skilled packaging engineer with a strong academic and professional background in electrical and computer engineering. He holds a Ph.D. in Electrical and Computer Engineering from Georgia Institute of Technology, where he also contributed as a Graduate Research Assistant at the 3D Systems Packaging Research Center. His work focuses on advanced packaging technologies, including chip-package co-design, process optimization, and characterization of high-performance packages. With expertise in various fabrication methods, including glass packaging and micro-via technology, Tailong has demonstrated his innovation in mm-Wave applications and mobile packages.

Education and Experience

Ph.D. in Electrical and Computer Engineering, Georgia Institute of Technology, 2020

M.S. in Electrical Engineering, Santa Clara University, 2014

B.Eng. in Information Engineering, Southeast University, 2012

Work Experience:

Packaging Engineer Intern, SiTime Corporation, 2018

Software Engineer Intern, Jiangsu Changdian Electronics Technology Co., 2011

Graduate Research Assistant, 3D Systems Packaging Research Center, Georgia Tech, 2016-2020

Suitability For The Award

Assoc.Prof.Dr. Tailong Shi is a highly suitable candidate for the Young Scientist Award due to his extensive research contributions in the field of electrical and computer engineering, particularly in the areas of chip-package co-design, process development, and packaging characterization. His expertise and innovative contributions demonstrate his leadership potential in advancing technology within his field.

Professional Development

Dr. Tailong Shi has continually honed his expertise through hands-on research and industry internships. His work has spanned diverse aspects of packaging design, fabrication, and process optimization, which has allowed him to lead projects on innovative packages such as ultra-thin Glass Panel Embedded (GPE) packages. He has collaborated with CMOS & MEMS design teams, coordinated reliability testing, and developed software to enhance production processes in the packaging industry. Tailong’s proficiency in multiple tools, including AutoCAD, HFSS, and Keysight ADS, allows him to tackle complex challenges in system integration and packaging design.

Research Focus

Dr. Tailong’s research primarily focuses on advanced packaging technologies for high-performance applications, particularly in mm-Wave systems and mobile devices. His work includes the design and fabrication of Glass Panel Embedded (GPE) packages, addressing issues like low-loss interconnections and warpage reduction. He has contributed significantly to the development of 2.5D and 3D packages, as well as Package-on-Package (PoP) systems. Tailong’s efforts in chip-package co-design have led to innovations in process optimization, such as glass-to-glass bonding and precise die placement, ensuring enhanced reliability and performance. 🧑‍🔬

Awards and Honors

Certified Software “Production Control System in Packaging Industry V1.0”, Jiangsu Changdian Electronics Technology Co., Ltd. (2012)
Research Excellence, Georgia Institute of Technology (2020)
Best Packaging Project, SiTime Corporation (2018)

Publications

“Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions”
“Residual Stress Control Based on Electroplated Metal Grain Characteristics in Panel-Level Glass Advanced Packaging”
“A Study on Glass Surface Activation Process to Enhance Glass-Metal Adhesion Strength in Glass Advanced Packaging”

Florin Boaca | Packaging Solutions | Best Researcher Award

Dr. Florin Boaca, Universitatea Națională de Știință și Tehnologie POLITEHNICA București, Romania.

Florin Boacă is an experienced Industrial Designer with a passion for furniture design, 3D modeling, and packaging. He has a strong background in industrial furniture design, metal structures, and packaging solutions, with a focus on sustainability and recycling of cellulosic materials. Florin has worked with various companies, including TRUSTEAM and Cube Production, while also freelancing as a graphic designer. He is currently pursuing a Ph.D. in Package Design at the Faculty of Industrial Engineering and Robotics in Bucharest. His expertise extends to CO2 laser operations, structural design, and innovative packaging solutions.

Publication profile

Orcid

Education and Experience

2022 – Present: Ph.D. in Package Design, Faculty of Industrial Engineering and Robotics, Bucharest
2019: Master in Industrial Design, Escuela Politécnica Superior de Ingeniería, Spain
2017 – 2019: Master in Integrated Mechanical Engineering, Bucharest
2013 – 2017: Bachelor’s in Industrial Design, Bucharest
2020 – 2021: Designer Industrial, TRUSTEAM
2017 – 2018: CO2 Laser Operator, Cube Production
2014 – 2019: Freelancer / Graphic Designer, 99design.com

Suitability For The Award

Dr. Florin Boacă demonstrates significant suitability for the Best Researcher Award based on his comprehensive expertise in industrial design, particularly in packaging and sustainable materials. His academic and professional contributions reflect a deep commitment to innovation and sustainability within the design field.

Professional Development ()

Florin Boacă has steadily developed his skills in industrial and graphic design, working on projects ranging from furniture and metal structures to packaging design. His role as a CO2 laser operator sharpened his technical expertise in material cutting and engraving, while his freelance work allowed him to explore innovative packaging concepts. With a keen interest in sustainable design, Florin integrates recycled materials into his projects. His academic pursuit of a Ph.D. in Package Design further deepens his commitment to designing eco-friendly and functional packaging, contributing to the global trend of green innovation in industrial design.

Research Focus

Dr.Florin Boacă’s research revolves around sustainable packaging design, with a special emphasis on the mechanical properties and durability of corrugated board. He explores advanced testing techniques for materials, working on finite element modeling (FEM) and shear tests to evaluate the strength of packaging solutions. Florin’s research aims to optimize the structure of packaging materials for enhanced durability while promoting eco-friendly solutions. His dedication to the field aligns with the increasing demand for sustainable packaging that reduces environmental impact while maintaining high performance in protecting goods.

Awards and Honors ()

2024: Published “Shear Test of Corrugated Board,” Journal of Research and Innovation for Sustainable Society
2023: Published “Basic Testing and Standards of Corrugated Board,” UPB Scientific Bulletin
2023: Published “A Simplified FEM Bending Model for Corrugated Board,” ACTA TECHNICA NAPOCENSIS
2021: Published “Mechanical Design of Corrugated Packaging Box,” Journal of Research and Innovation for Sustainable Society

Publications

Mechanical Analysis of Corrugated Cardboard Subjected to Shear Stresses (2024) | Cited by: N/A | DOI: 10.3390/jcs8100404
Shear Test of Corrugated Board (2024) | Cited by: N/A | DOI: 10.33727/JRISS.2024.1.5:41-46
Mechanical Design of Corrugated Packaging Box (2021) | Cited by: N/A | DOI: 10.33727/JRISS.2021.2.14:132-139
Automatization and Instrumentalization of a Semisolid Casting System (2019) | Cited by: N/A | Source: BASE

Tailong Shi | Glass Panel Embedded | Young Scientist Award

Tailong Shi | Glass Panel Embedded | Young Scientist Award

Assoc.Prof. Dr. Tailong Shi, Southeast University, China.

Publication profile

Scopus

Education and Experience

Work Experience:

Suitability For The Award

Professional Development

Research Focus

Awards and Honors

Publications

“Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions”

“Residual Stress Control Based on Electroplated Metal Grain Characteristics in Panel-Level Glass Advanced Packaging”

“A Study on Glass Surface Activation Process to Enhance Glass-Metal Adhesion Strength in Glass Advanced Packaging”